Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI).  Meer

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI).  Meer

This book provides an in-depth comparative study of legal responses to cyberterrorism in China and the UK to establish whether the relationship between legal systems and legal responses is necessary or contingent in the case of counter-cyberterrorism.  Meer

This book addresses the transfer of rhetorical knowledge from a first language (L1) to a second language (L1-to-L2 rhetorical transfer), a common cognitive phenomenon in the L2 writing of students in foreign language learning environments.  Meer